MWC 2014: New TriQuint MMPAs with Envelope Tracking Capture Design Wins in Leading LTE Smartphones.

Francisco De Jesùs.

New TriQuint MMPAs with Envelope Tracking Capture Design Wins in Leading LTE Smartphones

The versatile, highly integrated modules not only prolong battery life with new envelope tracking technology, but also simplify complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners

TriQuint Semiconductor, Inc , a leading RF solutions supplier and technology innovator, today announced three new multi-mode, multi-band power amplifier modules (MMPAs) that deliver longer battery life for LTE smartphones while simplifying increasingly complex RF design. The versatile new products, which are already capturing design wins in leading LTE smartphones, feature new envelope tracking technology as well as a new mobile chip interface.

“Building on the success of TriQuint’s highly integrated TRIUMF™ MMPAs, our three newest products add more LTE bands to cover more regional markets, as well as support for power-saving envelope tracking and a versatile new MIPI interface,” said Sean Riley, Vice President of Mobile Products.

Device manufacturers are adopting envelope tracking (ET) in next-generation smartphones to maximize energy efficiency. ET extends battery life by dynamically adjusting the supply voltage to the power amplifier (PA), in contrast to PAs with conventional constant-supply voltage. TriQuint’s new MMPAs also feature a new mobile chip interface — based on an open “MIPI” standard — used by several chipset providers to increase interoperability among vendors and reduce development time and effort.

In addition to designing ever more sophisticated devices, smartphone manufacturers serving the global market must produce several regional variants of each model to operate in carriers’ specific assigned spectrum. This is becoming more challenging as numerous new LTE bands are allocated. The versatile design of TriQuint‘s new MMPAs gives manufacturers a common platform to release new products at a faster pace, while controlling design and manufacturing costs. They support a growing number of popular 3G/4G bands for specific regions as well as quad-band GSM/EDGE. By integrating more functionality into smaller form factors, they simplify PCB routing, reduce BOM count and speed time to market. 

To learn more about TriQuint’s high-performance TRIUMF™ MMPAs, meet our technology experts at Mobile World Congress in Barcelona Feb. 24-27, or visit http://www.triquint.com/products/triumf. To locate TriQuint’s distributors, resellers or field sales representatives, see www.triquint.com/sales.

Media Contact: Ann Jansen

Marketing Comms Manager

TriQuint Semiconductor, Inc.

Tel: +1.503.615.9127

E-mail: ann.jansen@triquint.com